Package of environmental sensitive element

ABSTRACT

A package of an environmental sensitive element including a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure is provided. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films. The bonding strength between two adjacent second thin films is substantially equal to or lower than the bonding strength between two adjacent first thin films. Further, the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation-in-part application of and claims thepriority benefit of U.S. application Ser. No. 12/703,155, filed on Feb.9, 2010, now pending, which claims the priority benefit of Taiwanapplication serial no. 98131092, filed on Sep. 15, 2009. The entirety ofeach of the above-mentioned patent applications is hereby incorporatedby reference herein and made a part of this specification.

BACKGROUND

1. Technical Field

The present disclosure relates to a package of an environmentalsensitive element, and more particularly to a package of anenvironmental sensitive element having a flexible sacrificial layer.

2. Description of Related Art

Compared with normal rigid substrates, the flexible substrates have awider range of applications due to their advantages of flexibility, easeof carriage, safety, and wider product application range. However, thedrawbacks of the flexible substrate include poor resistance to heat,moisture, oxygen, and chemicals and large thermal expansion coefficient.Since typical flexible substrates cannot entirely avoid the transmissionof water vapor and oxygen, devices on these substrates experienceaccelerated aging. Consequently, these short-lived devices fail to meettheir commercial needs. Besides, since the flexible substrate hasflexibility, when the flexible substrate is bent, the OLED structurewill be damaged by bending force. Thus, the OLED device cannot normallyoperate.

In the conventional technologies, such as those described in the U.S.Pat. No. 6,624,568 and in the US Patent Publication No. 2007/0049155,the polymer is used as the packaging material for the organicelectro-emitting element. Although the resistance to moisture and theoxygen of the polymer is relatively better, the conventionaltechnologies never consider the delaminating problem while the OLEDdevice is bent. Therefore, how to improve the delaminating phenomenon ofthe OLED device while it is bent is one of the immediate problems to beresolved in the current flexibility of the OLED device.

SUMMARY

The present disclosure provides a package of an environmental sensitiveelement, wherein the package includes a flexible substrate, anenvironmental sensitive element, a flexible sacrificial layer and apackaging structure. The environmental sensitive element is disposed onthe flexible substrate. The flexible sacrificial layer is disposed onthe environmental sensitive element, wherein the environmental sensitiveelement includes a plurality of first thin films and the flexiblesacrificial layer includes a plurality of second thin films, and thebonding strength between two adjacent second thin films is equal to orlower than the bonding strength between two adjacent first thin films.The packaging structure covers the environmental sensitive element andthe flexible sacrificial layer.

The present disclosure provides a package of an environmental sensitiveelement, wherein the package includes a flexible substrate, anenvironmental sensitive element, a flexible sacrificial layer and apackaging structure. The environmental sensitive element is disposed onthe flexible substrate. The flexible sacrificial layer is disposed onthe environmental sensitive element, wherein the environmental sensitiveelement comprises a plurality of first thin films, and the flexiblesacrificial layer includes a plurality of second thin films, and thebonding strength between two adjacent second thin films is equal to orlower than the bonding strength between two adjacent first thin films.The second thin films in the flexible sacrificial layer comprise atleast one sacrificial thin film and at least one flexible protectingthin film. The at least one sacrificial thin film is disposed on thefirst thin films, wherein the material of the at least one sacrificialthin film includes organic small molecular material with the molecularweight about 10 g/mol˜5000 g/mol or organic oligomers with the molecularweight about 500 g/mol˜9000 g/mol. The packaging structure covers theenvironmental sensitive element and the flexible sacrificial layer.

The present disclosure provides a package of an environmental sensitiveelement, wherein the package includes a flexible substrate, anenvironmental sensitive element, a first packaging structure and a firstflexible sacrificial layer. The environmental sensitive element isdisposed on the flexible substrate. The first packaging structure coversthe environmental sensitive element. The first flexible sacrificiallayer is disposed on the first packaging structure, and the firstflexible sacrificial layer and the environmental sensitive element arelocated on two opposite sides of the first packaging structure, whereinthe environmental sensitive element comprises a plurality of first thinfilms, the first flexible sacrificial layer includes a plurality ofsecond thin films, and the bonding strength between two adjacent secondthin films is equal to or lower than the bonding strength between twoadjacent first thin films.

In order to make the aforementioned and other features and advantages ofthe disclosure more comprehensible, embodiments accompanying figures aredescribed in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the disclosure, and are incorporated in and constitutea part of this specification. The drawings illustrate embodiments of thedisclosure and, together with the description, serve to explain theprinciples of the disclosure.

FIG. 1A, FIG. 1B, FIG. 1C and FIG. 1D are the cross-sectional views of apackage of an environmental sensitive element according to the firstembodiment of the present disclosure.

FIG. 2A and FIG. 2B are the cross-sectional views of a package of anenvironmental sensitive element according to the second embodiment ofthe present disclosure.

FIG. 3A and FIG. 3B are the cross-sectional views of a package of anenvironmental sensitive element according to the third embodiment of thepresent disclosure.

FIG. 4A is the cross-sectional view of a package of an environmentalsensitive element according to the fourth embodiment of the presentdisclosure.

FIG. 4B is the top view of the package of the environmental sensitiveelement in FIG. 4A.

FIG. 5A is the cross-sectional view of a package of an environmentalsensitive element according to the fifth embodiment of the presentdisclosure.

FIG. 5B is the top view of the package of the environmental sensitiveelement in FIG. 5A.

FIG. 6A is the cross-sectional view of a package of an environmentalsensitive element according to the sixth embodiment of the presentdisclosure.

FIG. 6B is the top view of the package of the environmental sensitiveelement in FIG. 6A.

FIG. 7 is the cross-sectional view of a package of an environmentalsensitive element according to the seventh embodiment of the presentdisclosure.

FIG. 8 is the cross-sectional view of a package of an environmentalsensitive element according to the eighth embodiment of the presentdisclosure.

FIG. 9 is the cross-sectional view of a package of an environmentalsensitive element according to the ninth embodiment of the presentdisclosure.

FIG. 10 is the cross-sectional view of a package of an environmentalsensitive element according to the tenth embodiment of the presentdisclosure.

FIG. 11 is the cross-sectional view of a package of an environmentalsensitive element according to the eleventh embodiment of the presentdisclosure.

FIG. 12 is the cross-sectional view of a package of an environmentalsensitive element according to the twelfth embodiment of the presentdisclosure.

DESCRIPTION OF EMBODIMENTS First Embodiment

FIG. 1A and FIG. 1B are the cross-sectional views of a package of anenvironmental sensitive element according to the second embodiment ofthe present disclosure. As shown in FIG. 1A and FIG. 1B, a package 100of an environmental sensitive element of the present embodiment includesa flexible substrate 110, an environmental sensitive element 120, aflexible sacrificial layer 130 and a packaging structure 140. Theenvironmental sensitive element 120 is disposed on the flexiblesubstrate 110. The flexible sacrificial layer 130 is disposed on theenvironmental sensitive element 120, wherein the environmental sensitiveelement 120 includes a plurality of first thin films (DM, B, T) and theflexible sacrificial layer 130 includes a plurality of second thin films(132 and 134) which are stacked on each other. Further, the bondingstrength between two adjacent second thin films (132 and 134) issubstantially equal to or lower than the bonding strength between twoadjacent first thin films (DM, B, T). The packaging structure 140 coversthe environmental sensitive element 120 and the flexible sacrificiallayer 130.

In the present embodiment, material of the flexible substrate 110 canbe, for example, plastic material such as PE plastic, PMMA, PC(polycarbonate) or PI (polyimide). For instance, the PE plastic can bethe flexible plastic material such as PEC, PEN and PES. Moreover, thematerial of the flexible substrate 110 comprises metal foil.

As shown in FIG. 1A, the environmental sensitive element 120 comprises abottom electrode layer B, a displaying medium DM and a top electrodelayer T. The bottom electrode layer B is disposed on the flexiblesubstrate 110, the displaying medium DM is disposed on bottom electrodelayer B and the top electrode layer T is disposed on the displayingmedium DM. More clearly, the displaying medium DM is composed of a holeinjection layer HIL, a hole transporting layer HTL, an organicelectro-emitting layer EML and an electron transporting layer ETL. Thehole injection layer HIL is disposed on the bottom electrode layer B,the hole transporting layer HTL is disposed on the hole injection layerHIL, the organic electro-emitting layer EML is disposed on the holetransporting layer HTL, and the electron transporting layer ETL isdisposed on the organic electro-emitting layer EML. Furthermore, the topelectrode layer T is disposed on the electron transporting layer ETL.

The environmental sensitive element 120 of the present embodiment can bean active matrix element or a passive matrix element. When theenvironmental sensitive element 120 is the active matrix element, thebottom electrode layer B can be, for example, a pixel electrode of thethin film transistor array and the top electrode layer can be, forexample, a common electrode. Meanwhile, the displaying medium betweeneach of the pixel electrodes and the common electrode can beindividually driven to emit lights. When the environmental sensitiveelement 120 is the passive matrix element, the bottom electrode layer Band the top electrode layer are the stripe electrodes, and the bottomelectrode layer B and the top electrode layer T are arranged in aninterlacing manner. Meanwhile, the displaying medium located at thecrossover section where each of the top electrode layer T interlaces thebottom electrode layer B can be individually driven to emit lights. Inthe present embodiment, the extending direction of the bottom electrodelayer B can be, for example, substantially perpendicular to theextending direction of the top electrode layer T.

As shown in FIG. 1A, the flexible sacrificial layer 130 comprises asacrificial thin film 132 and a flexible protecting thin film 134,wherein the sacrificial thin film 132 is configured on the top electrodelayer T of the environmental sensitive element 120 and the flexibleprotecting thin film 134 is configured on the sacrificial thin film 132.It should be noticed that, the sacrificial thin film 132 of the presentembodiment is connected to the top electrode layer T, but the flexibleprotecting thin film 134 is disconnected to the top electrode layer T.However, in other embodiments of the present disclosure, the flexibleprotecting thin film 134 disposed on the sacrificial thin film 132 canbe connected to the top electrode layer T. The bonding strength betweenthe sacrificial thin film 132 and the top electrode layer T issubstantially equal to or lower than the bonding strength between twoadjacent first thin films (DM, B and T) so that the delaminatingphenomenon hardly happens between the adjacent first thin films (DM, Band T) but easily happens on the interface between the sacrificial thinfilm 132 and the top electrode layer T and on the interface between thesacrificial thin film 132 and the flexible protecting thin film 134 whenthe package of the environmental sensitive element is bent. Therefore,the sacrificial thin film 132 and the flexible protecting thin film 134can effectively protect the first thin films (DM, B and T) from havingdelaminating phenomenon during the package is bent. In addition, theflexible sacrificial layer 130 further has a UV cutting function so asto increase the life time of the environmental sensitive element 120.And also the flexible sacrificial layer 130 further has a light outcoupling function so as to increase the light efficiency of theenvironmental sensitive element 120.

In the present embodiment, the material of the sacrificial thin films132 includes organic small molecular compounds, organic oligomers, metalor organic-inorganic co-evaporated material. The molecular weight of theaforementioned organic small molecular material is about 10 g/mol˜5000g/mol and the organic small molecular material includes Alq3(Tris-(8-hydroxyquinoline)aluminum), alpha-NPB(N,N′-Dis(naphthalene-1-yl)-N,N′-diphenyl-benzidine), CuPc (Phalocyaninecopper complex). The molecular weight of the organic oligomers is about500 g/mol˜9000 g/mol and the organic oligomers include PhenyleneVinylene Oligomers or Fluorene Oligomers. The molecular weight of metalor organic-inorganic co-evaporated material is about 3 g/mol˜500 g/mol.More clearly, the aforementioned metal can be, for example, Al, Ag, Be,Cr, Cu, Co, Fe, Ge, Ir, In, Mo, Mn, Mg, Ni, Nb, Pb, Pd, Pt, Ru, Rh, Sn,Si, Sb, Se, Ti, Ta, Te, V, W, Zr, Zn, Mg—Ag, Al—Si, Al—Si—Cu, Au/Ge,Au—Be, Au—Ge—N, Ni—Cr, Pb—sn or In—Sn.

In addition, the material of the sacrificial thin film 132 furtherincludes a single or a mixture of aromatic tertiary amine compounds.More clearly, the aromatic tertiary amine compounds may be1,1-bis(4-di-p-tolylaminophenyl)cyclohexane,1,1-bis(4-di-p-tolylaminophenyl)-4-phenylcyclohexane,1,5-bis[N-(1-naphthyl)-N-phenylamino]naphthalene,2,6-bis(di-p-tolylamino)naphthalene,2,6-bis[di-(1-naphthyl)amino]naphthalene,2,6-bis[N-(1-naphthyl)-N-(2-naphthyl)amino]naphthalene,2,6-bis[N,N-di(2-naphthyl)amine]fluorene,4-(di-p-tolylamino)-4′-[4(di-p-tolylamino)-styryl]stilbene,4,4′-bis(diphenylamino)quadriphenyl,4,4″-bis[N-(1-anthryl)-N-phenylamino]-p-terphenyl,4,4′-bis[N-(1-coronenyl)-N-phenylamino]biphenyl,4,4′-bis[N-(1-naphthyl)-N-phenylamino]biphenyl (NPB),4,4′-bis[N-(1-naphthyl)-N-(2-naphthyl)amino]biphenyl (TNB),4,4″-bis[N-(1-naphthyl)-N-phenylamino]p-terphenyl,4,4′-bis[N-(2-naphthacenyl)-N-phenylamino]biphenyl,4,4′-bis[N-(2-naphthyl)-N-phenylamino]biphenyl,4,4′-bis[N-(2-perylenyl)-N-phenylamino]biphenyl,4,4′-bis[N-(2-phenanthryl)-N-phenylamino]biphenyl,4,4′-bis[N-(2-pyrenyl)-N-phenylamino]biphenyl,4,4′-bis[N-(3-acenaphthenyl)-N-phenylamino]biphenyl,4,4′-bis[N-(3-methylphenyl)-N-phenylamino]biphenyl (TPD),4,4′-bis[N-(8-fluoranthenyl)-N-phenylamino]biphenyl,4,4′-bis[N-(9-anthryl)-N-phenylamino]biphenyl,4,4′-bis{N-phenyl-N-[4-(1-naphthyl)-phenyl]amino}biphenyl,4,4′-bis[N-phenyl-N-(2-pyrenyl)amino]biphenyl,4,4′,4″-tris[(3-methylphenyl)phenylamino]triphenylamine (m-TDATA),Bis(4-dimethylamino-2-methylphenyl)-phenylmethane, N-phenylcarbazole,N,N′-bis[4-([1,1′-biphenyl]-4-ylphenylamino)phenyl]-N,N′-di-1-naphthalenyl-[1,1′-biphenyl]-4,4′-diamine,N,N′-bis[4-(di-1-naphtbalenylamino)phenyl]-N,N′-di-1-naphthalenyl-[1,1′-biphenyl]-4,4′-diamine,N,N′-bis[4-[(3-methylphenyl)phenylamino]phenyl]-N,N′-diphenyl-[1,1′-biphenyl]-4,4′-diamine,N,N-bis[4-(diphenylamino)phenyl]-N′,N′-dipheny-[1,1′-biphenyl]-4,4′-diamine,N,N′-di-1-naphthalenyl-N,N′-bis[4-(1-naphthalenylphenylamino)phenyl]-[1,1′-biphenyl]-4,4′-diamine,N,N′-di-1-naphthalenyl-N,N′-bis[4-(2-naphthalenylphenylamino)phenyl]-[1,1′-biphenyl]-4,4′-diamine,N,N,N-tri(p-tolyl)amine, N,N,N′,N′-tetra-p-tolyl-4-4′-diaminobiphenyl,N,N,N′,N′-tetraphenyl-4,4′-diaminobiphenyl,N,N,N′,N′-tetra-1-naphthyl-4,4′-diaminobiphenyl,N,N,N′,N′-tetra-2-naphthyl-4,4′-diaminobiphenyl, orN,N,N′,N′-tetra(2-naphthyl)-4,4″-diamino-p-terphenyl.

Moreover, the material of the flexible protecting thin film 134comprises indium tin oxide (ITO), indium zinc oxide (IZO), aluminumdoped zinc oxide (AZO), WO₃, MoO₃, SiO_(x), SiN_(X), SiO_(x)N_(y),Al₂O₃, Al, Ag, Mg—Ag or Mg—Al. It should be noticed that the materialsof the sacrificial thin film 132 and the flexible protecting thin film134 in the flexible sacrificial layer 130 are selected from differentmaterial groups such that the bonding strength between the sacrificialthin film 132 and the flexible protecting thin film 134 is substantiallyequal to or smaller than the bonding strength between the adjacent firstthin films (DM, B and T).

As shown in FIG. 1A, the packaging structure 140 comprises a sealant142, an adhesion layer 144 and a flexible cover 146. The sealant 142 isdisposed on the flexible substrate 110 to encircle the environmentalsensitive element 120 and the flexible sacrificial layer 130. Theadhesion layer 144 is disposed within the sealant 142 to cover theenvironmental sensitive element 120 and the flexible sacrificial layer130. Further, the flexible cover 146 is connected with the sealant 142and the adhesion layer 144.

As shown in FIG. 1B, the packaging structure 140 can also be other typesof structure. For instance, the packaging structure can comprise anadhesion layer 144 and a flexible cover 146, wherein the adhesion layer144 covers the environmental sensitive element 120 and the flexiblesacrificial layer 130, and the flexible cover 146 is connected to theadhesion layer 144.

As shown in FIG. 1C, the packaging structure 140′ with other packagingstructure type is used in the present embodiment. For instance, thepackaging structure 140′ can comprise a plurality of package thin films.The package thin films include a plurality of organic package thin films148 a and a plurality of inorganic package thin films 148 b. The organicthin films 148 a and the inorganic thin films 148 b are stacked on oneanother to provide a relatively better moisture-proof ability.

As shown in FIG. 1D, the packaging structure 140″ with other packagingstructure type is used in the present embodiment. For instance, thepackaging structure 140″ can comprise a sealant 142, an adhesion layer144, a flexible cover 146, at least one layer of organic package thinfilms 148 a and at least one layer of inorganic package thin films 148b. The organic thin films 148 a and the inorganic thin films 148 b arestacked on one another to provide a relatively better moisture-proofability. The sealant 142 is disposed on the flexible substrate 110 toencircle the environmental sensitive element 120 and the flexiblesacrificial layer 130. The adhesion layer 144 is disposed within thesealant 142 to cover the organic package thin films 148 a, the inorganicpackage thin films 148 b and the flexible sacrificial layer 130.Further, the flexible cover 146 is connected with the sealant 142 andthe adhesion layer 144.

It should be noticed that the aforementioned organic package thin films148 a and the inorganic package thin film 148 b can be arranged alone oralternately stacked on one another.

In a present embodiment, the material of the top electrode layer T canbe, for example, as same as the material of the flexible protecting thinfilm 134, and the material of the sacrificial thin film 132 can be, forexample, as same as the material of the hole transporting layer HTL.Therefore, the process for forming the flexible sacrificial layer 130can be integrated with the process for forming the environmentalsensitive element 120. In other words, the flexible sacrificial layer130 and the environmental sensitive element 120 can be manufactured inthe same process chamber without further modifying the current processprocedure.

Second Embodiment

FIG. 2A and FIG. 2B are the cross-sectional views of a package of anenvironmental sensitive element according to the second embodiment ofthe present disclosure. As shown in FIG. 2A and FIG. 2B, the package 100a of the environmental sensitive element of the present embodiment issimilar to the package 100 of the environmental sensitive element of thefirst embodiment. More clearly, the thin film structure of the flexiblesacrificial layer 130 a in the package 100 a is different from that ofthe flexible sacrificial layer 130 in the package 100. The flexiblesacrificial layer 130 a comprises a plurality of sacrificial thin films132 and a plurality of flexible protecting thin films 134, wherein thesacrificial thin films 132 and the flexible protecting thin films 134are alternately stacked on one another and are configured on the topelectrode layer T of the environmental sensitive element 120 and thebottommost sacrificial thin film 132 is connected to the top electrodelayer T. Moreover, the flexible protecting thin films 134 of the presentembodiment are disconnected to the top electrode layer T.

The Third Embodiment

FIG. 3A and FIG. 3B are the cross-sectional views of a package of anenvironmental sensitive element according to the third embodiment of thepresent disclosure. As shown in FIG. 3A and FIG. 3B, the package 100 bof the environmental sensitive element of the present embodiment issimilar to the package 100 a of the environmental sensitive element ofthe second embodiment. More clearly, the thin film structure of theflexible sacrificial layer 130 b in the package 100 b is different fromthat of the flexible sacrificial layer 130 a in the package 100 a. Theflexible sacrificial layer 130 b comprises a plurality of sacrificialthin films 132 and a plurality of flexible protecting thin films 134,wherein the sacrificial thin films 132 and the flexible protecting thinfilms 134 are alternately stacked on one another and are configured onthe top electrode layer T of the environmental sensitive element 120 andthe bottommost sacrificial thin film 132 and all of the flexibleprotecting thin films 134 are connected to the top electrode layer T.

Experimental Example

Table 1 is a detailed explanation of the structure of the package of theenvironmental sensitive element, wherein illuminant area of the packageis about 0.3 centimeter×0.3 centimeter.

TABLE 1 Flexible Lower EML EIL/top Structure Upper Sustrate ElectrodeHTL (Dopant:Host) ETL electrode Layer Substrate Experimental PES ITO NPBIr(ppy)₃ CBP Bphen LiF5 {acute over (Å)}/ NPB/Al Metal group I 200{acute over (Å)} 7% 300 {acute over (Å)} 300 {acute over (Å)} Al 1500{acute over (Å)} 1500 {acute over (Å)}/ Foil 1500 {acute over (Å)}Control group I PES ITO NPB Ir(ppy)₃ CBP Bphen LiF5 {acute over (Å)}/NPB/Al/ Metal 200 {acute over (Å)} 7% 300 {acute over (Å)} 300 {acuteover (Å)} Al 1500 {acute over (Å)} 0 {acute over (Å)}/0 {acute over (Å)}Foil 1500 {acute over (Å)}

The package of the environmental sensitive element manufacturedaccording to the standards of the experimental group I and control groupI is normally lighting on before it goes through the bending test. Afterthe bending test (the package is bent for 500 times with a radius ofcurvature of about 5 centimeter), the package of the environmentalsensitive element of the control group I can not light on. The packageof the environmental sensitive element of the experimental group I isdriven by a voltage of 4V to light on with a brightness about 820Cd/m̂2and a light emitting efficiency about 14.0 Cd/A before it goes throughthe bending test. After the bending test (the package is bent for 500times with a radius of curvature of about 5 centimeter), the package ofthe environmental sensitive element of the experimental group I isdriven by a voltage of 4V to light on with a brightness about 793 Cd/m̂2and a light emitting efficiency about 13.9 Cd/A. Obviously, the lightemitting efficiency of the package of the environmental sensitiveelement of the experimental group I (i.e. one of the embodiments of thepresent disclosure) does not significantly decayed.

The Fourth Embodiment

FIG. 4A is the cross-sectional view of a package of an environmentalsensitive element according to the fourth embodiment of the presentdisclosure. FIG. 4B is the top view of the package of the environmentalsensitive element in FIG. 4A. As shown in FIG. 4A and FIG. 4B, thepackage 100 c of the environmental sensitive element of the presentembodiment is similar to the package 100 of the environmental sensitiveelement of the first embodiment. Specifically, the first packagingstructure 140′ covers the environmental sensitive element 120 and afirst flexible sacrificial layer 150 is disposed on the first packagingstructure 140′, wherein the environmental sensitive element 120 and thefirst flexible sacrificial layer 150 are located on two opposite sidesof the first packaging structure 140′. The first packaging structure140′ comprises at least one layer of organic package thin films 148 aand at least one layer of inorganic package thin films 148 b.

As shown in FIG. 4A, the first flexible sacrificial layer 150 comprisesa first sacrificial thin film 152 and a first flexible protecting thinfilm 154, wherein the first sacrificial thin film 152 is configured onthe first packaging structure 140′ and the first flexible protectingthin film 154 is configured on the first sacrificial thin film 152. Itshould be noticed that, the first sacrificial thin film 152 of thepresent embodiment is connected to the first packaging structure 140′,but the first flexible protecting thin film 154 is disconnected to thefirst packaging structure 140′. In other embodiments of the presentdisclosure, the first flexible protecting thin film 154 disposed on thefirst sacrificial thin film 152 can be connected to the first packagingstructure 140′. The bonding strength between the first sacrificial thinfilm 152 and the first packaging structure 140′ is substantially equalto or lower than the bonding strength between two adjacent first thinfilms (DM, B and T) so that the delaminating phenomenon hardly happensbetween the adjacent first thin films (DM, B and T) but easily happenson the interface between the first sacrificial thin film 152 and thefirst packaging structure 140′ and on the interface between the firstsacrificial thin film 152 and the first flexible protecting thin film154 when the package of the environmental sensitive element is bent.Therefore, the first sacrificial thin film 152 and the first flexibleprotecting thin film 154 can effectively protect the first thin films(DM, B and T) from having delaminating phenomenon during the package isbent. In addition, the first flexible sacrificial layer 150 further hasa UV cutting function so as to increase the life time of theenvironmental sensitive element 120. And also the first flexiblesacrificial layer 150 further has a light out coupling function so as toincrease the light efficiency of the environmental sensitive element120.

In the present embodiment, the material of the first sacrificial thinfilm 152 is identical to the material of the sacrificial thin film 132,and the material of the first flexible protecting thin film 154 isidentical to the material of the flexible protecting thin film 134. Itshould be noticed that the materials of the first sacrificial thin film152 and the first flexible protecting thin film 154 in the firstflexible sacrificial layer 150 are selected from different materialgroups such that the bonding strength between the first sacrificial thinfilm 152 and the first flexible protecting thin film 154 issubstantially equal to or smaller than the bonding strength between theadjacent first thin films (DM, B and T).

As shown in FIG. 4A and FIG. 4B, the first flexible sacrificial layer150 is greater than the size of the environmental sensitive element 120in the present embodiment. However, in other embodiments, the size ofthe first flexible sacrificial layer 150 can be equal to the size of theenvironmental sensitive element 120.

The Fifth Embodiment

FIG. 5A is the cross-sectional view of a package of an environmentalsensitive element according to the fifth embodiment of the presentdisclosure. FIG. 5B is the top view of the package of the environmentalsensitive element in FIG. 5A. As shown in FIG. 5A and FIG. 5B, thepackage 100 d of the environmental sensitive element of the presentembodiment is similar to the package 100 c of the environmentalsensitive element of the fourth embodiment. Specifically, the package100 d of the environmental sensitive element of the present embodimentfurther comprises a second packaging structure 160 covering theenvironmental sensitive element 120, the first packaging structure 140′and the first flexible sacrificial layer 150. The second packagingstructure 160 comprises a sealant 162, an adhesion layer 164 and aflexible cover 166. The sealant 162 is disposed on the flexiblesubstrate 110 to encircle the environmental sensitive element 120 andthe first flexible sacrificial layer 150. The adhesion layer 164 isdisposed within the sealant 162 to cover the environmental sensitiveelement 120 and the first flexible sacrificial layer 150. Further, theflexible cover 166 is connected with the sealant 162 and the adhesionlayer 164.

As shown in FIG. 5A and FIG. 5B, the sealant 162 of the second packagingstructure 160 has a continuous pattern encircling the environmentalsensitive element 120. However, in other embodiments, the sealant 162 ofthe second packaging structure 160 may have a non-continuous patternencircling the environmental sensitive element 120. For example, thesealant 162 may includes a plurality of patterns separated from eachother, wherein the separated patterns are arranged in a continuous formso as to encircle the environmental sensitive element 120. In addition,the material of the sealant 162 and the material of the adhesion layer164 are different in the present embodiment. However, in otherembodiments, the material of the sealant 162 and the material of theadhesion layer 164 may be identical.

The Sixth Embodiment

FIG. 6A is the cross-sectional view of a package of an environmentalsensitive element according to the sixth embodiment of the presentdisclosure. FIG. 6B is the top view of the package of the environmentalsensitive element in FIG. 6A. As shown in FIG. 6A and FIG. 6B, thepackage 100 e of the environmental sensitive element of the presentembodiment is similar to the package 100 d of the environmentalsensitive element of the fifth embodiment. Specifically, the adhesionlayer 164 of a second packaging structure 160′ is a film type adhesive.The adhesion layer 164 covers the environmental sensitive element 120and the first flexible sacrificial layer 150. Further, the flexiblecover 166 is connected with the adhesion layer 164.

The Seventh Embodiment

FIG. 7 is the cross-sectional view of a package of an environmentalsensitive element according to the seventh embodiment of the presentdisclosure. As shown in FIG. 7, the package 100 f of the environmentalsensitive element of the present embodiment is similar to the package100 c of the environmental sensitive element of the fourth embodiment.Specifically, the thin film structure of the first flexible sacrificiallayer 150 a in the package 100 f is different from that of the firstflexible sacrificial layer 150 in the package 100 c. The first flexiblesacrificial layer 150 a comprises a plurality of first sacrificial thinfilms 152 and a plurality of first flexible protecting thin films 154,wherein the first sacrificial thin films 152 and the first flexibleprotecting thin films 154 are alternately stacked on one another and areconfigured on the first packaging structure 140′ and the bottommostfirst sacrificial thin film 152 is connected to the first packagingstructure 140′. Moreover, as shown in FIG. 7, the first flexibleprotecting thin films 154 of the present embodiment are disconnected tothe first packaging structure 140′.

The Eighth Embodiment

FIG. 8 is the cross-sectional view of a package of an environmentalsensitive element according to the eighth embodiment of the presentdisclosure. As shown in FIG. 8, the package 100 g of the environmentalsensitive element of the present embodiment is similar to the package100 f of the environmental sensitive element in FIG. 7. Specifically,the thin film structure of the first flexible sacrificial layer 150 b inthe package 100 g is different from that of the first flexiblesacrificial layer 150 a in the package 100 f. The first flexiblesacrificial layer 150 b comprises a plurality of first sacrificial thinfilms 152 and a plurality of first flexible protecting thin films 154,wherein the first sacrificial thin films 152 and the first flexibleprotecting thin films 154 are alternately stacked on one another and areconfigured on the first packaging structure 140′ and the bottommostfirst sacrificial thin film 152 and the bottommost first flexibleprotecting thin films 154 are connected to the first packaging structure140′.

The Ninth Embodiment

FIG. 9 is the cross-sectional view of a package of an environmentalsensitive element according to the ninth embodiment of the presentdisclosure. As shown in FIG. 9, the package 100 h of the environmentalsensitive element of the present embodiment is similar to the package100 c of the environmental sensitive element of the fourth embodiment.Specifically, the package 100 h further comprises a second flexiblesacrificial layer 160 disposed on the environmental sensitive element120.

As shown in FIG. 9, the second flexible sacrificial layer 170 comprisesa second sacrificial thin film 172 and a second flexible protecting thinfilm 174, wherein the second sacrificial thin film 172 is configure onthe top electrode layer T of the environmental sensitive element 120 andthe second flexible protecting thin film 174 is configured on the secondsacrificial thin film 172. It should be noticed that, the secondsacrificial thin film 172 of the present embodiment is connected to thetop electrode layer T, but the second flexible protecting thin film 174is disconnected to the top electrode layer T. However, in otherembodiments of the present disclosure, the second flexible protectingthin film 174 disposed on the second sacrificial thin film 172 can beconnected to the top electrode layer T.

In the present embodiment, the material of the second sacrificial thinfilm 172 is identical to the material of the sacrificial thin film 132,and the material of the second flexible protecting thin film 174 isidentical to the material of the flexible protecting thin film 134. Itshould be noticed that the materials of the second sacrificial thin film172 and the second flexible protecting thin film 174 in the secondflexible sacrificial layer 170 are selected from different materialgroups such that the bonding strength between the second sacrificialthin film 172 and the second flexible protecting thin film 174 issubstantially equal to or smaller than the bonding strength between theadjacent first thin films (DM, B and T).

Further, the bonding strength between the second sacrificial thin film172 and the top electrode layer T is substantially equal to or lowerthan the bonding strength between two adjacent first thin films (DM, Band T) so that the delaminating phenomenon hardly happens between theadjacent first thin films (DM, B and T) but easily happens on theinterface between the second sacrificial thin film 172 and the topelectrode layer T and on the interface between the second sacrificialthin film 172 and the second flexible protecting thin film 174 when thepackage of the environmental sensitive element is bent. Therefore, thesecond sacrificial thin film 172 and the second flexible protecting thinfilm 174 can effectively protect the first thin films (DM, B and T) fromhaving delaminating phenomenon during the package is bent. In addition,the second flexible sacrificial layer 170 further has a UV cuttingfunction so as to increase the life time of the environmental sensitiveelement 120. And also the second flexible sacrificial layer 170 furtherhas a light out coupling function so as to increase the light efficiencyof the environmental sensitive element 120.

The Tenth Embodiment

FIG. 10 is the cross-sectional view of a package of an environmentalsensitive element according to the tenth embodiment of the presentdisclosure. As shown in FIG. 10, the package 100 i of the environmentalsensitive element of the present embodiment is similar to the package100 h of the environmental sensitive element of the ninth embodiment.Specifically, the package 100 i of the environmental sensitive elementof the present embodiment further comprises a second packaging structure160 covering the environmental sensitive element 120, the firstpackaging structure 140′, the first flexible sacrificial layer 150 andthe second flexible sacrificial layer 170.

The Eleventh Embodiment

FIG. 11 is the cross-sectional view of a package of an environmentalsensitive element according to the eleventh embodiment of the presentdisclosure. As shown in FIG. 11, the package 100 j of the environmentalsensitive element of the present embodiment is similar to the package100 h of the environmental sensitive element of the ninth embodiment.Specifically, the thin film structure of the first flexible sacrificiallayer 150 a in the package 100 j is different from that of the firstflexible sacrificial layer 150 in the package 100 h. The first flexiblesacrificial layer 150 a comprises a plurality of first sacrificial thinfilms 152 and a plurality of first flexible protecting thin films 154,wherein the first sacrificial thin films 152 and the first flexibleprotecting thin films 154 are alternately stacked on one another and areconfigured on the first packaging structure 140′ and the bottommostfirst sacrificial thin film 152 is connected to the first packagingstructure 140′. Moreover, as shown in FIG. 10, the first flexibleprotecting thin films 154 of the present embodiment are disconnected tothe first packaging structure 140′.

Furthermore, the thin film structure of the second flexible sacrificiallayer 170 a in the package 100 j is different from that of the secondflexible sacrificial layer 170 in the package 100 h. The second flexiblesacrificial layer 170 a comprises a plurality of second sacrificial thinfilms 172 and a plurality of second flexible protecting thin films 174,wherein the second sacrificial thin films 172 and the second flexibleprotecting thin films 174 are alternately stacked on one another and areconfigured on the environmental sensitive element 120, and thebottommost second sacrificial thin film 172 is connected to theenvironmental sensitive element 120. Moreover, as shown in FIG. 10, thesecond flexible protecting thin films 174 of the present embodiment aredisconnected to the environmental sensitive element 120.

The Twelfth Embodiment

FIG. 12 is the cross-sectional view of a package of an environmentalsensitive element according to the twelfth embodiment of the presentdisclosure. As shown in FIG. 12, the package 100 k of the environmentalsensitive element of the present embodiment is similar to the package100 j of the environmental sensitive element of the eleventh embodiment.Specifically, the thin film structures of the first flexible sacrificiallayer 150 b in the package 100 k is different from that of the firstflexible sacrificial layer 150 a in the package 100 j. The bottommostfirst sacrificial thin film 152 and the bottommost first flexibleprotecting thin film 154 are connected to the first packaging structure140′.

Furthermore, the thin film structure of the second flexible sacrificiallayer 170 b in the package 100 k is different from that of the secondflexible sacrificial layer 170 a in the package 100 j. The bottommostsecond sacrificial thin film 172 and the bottommost second flexibleprotecting thin film 174 are connected to the environmental sensitiveelement 120.

According to the above embodiments and the experimental example, sincethe flexible sacrificial layer with various types is formed on theenvironmental sensitive element, when the environmental sensitiveelement is exaggeratedly bent, the delaminating happens in the flexiblesacrificial layer. Therefore, the environmental sensitive element can beprevented from the delaminating phenomenon due to being bent and thestructure of the environmental sensitive element can be prevented frombeing damaged during it is bent.

What is claimed is:
 1. A package of an environmental sensitive element,comprising: a flexible substrate; an environmental sensitive elementdisposed on the flexible substrate; at least one flexible sacrificiallayer disposed on the environmental sensitive element, wherein theenvironmental sensitive element comprises a plurality of first thinfilms, the flexible sacrificial layer includes a plurality of secondthin films, and the bonding strength between two adjacent second thinfilms is equal to or lower than the bonding strength between twoadjacent first thin films, and the second thin films in the flexiblesacrificial layer comprise: at least one sacrificial thin film disposedon the first thin films, wherein the material of the at least onesacrificial thin film includes organic small molecular material with themolecular weight about 10 g/mol˜5000 g/mol or organic oligomers with themolecular weight about 500 g/mol˜9000 g/mol; and at least one flexibleprotecting thin film; and a packaging structure covering theenvironmental sensitive element and the flexible sacrificial layer. 2.The package of claim 1, wherein the first thin films in theenvironmental sensitive element comprises: a bottom electrode layerdisposed on the flexible substrate; a displaying medium disposed on thebottom electrode layer; and a top electrode layer disposed on thedisplaying medium.
 3. The package of claim 2, wherein the sacrificialthin film is connected to the top electrode layer, and the flexibleprotecting thin film is disconnected to the top electrode layer.
 4. Thepackage of claim 2, wherein both of the sacrificial thin film and theflexible protecting thin film are connected to the top electrode layer.5. The package of claim 2, wherein the bonding strength between thesacrificial thin film and the top electrode layer is equal to or lowerthan the bonding strength between two adjacent first thin films.
 6. Thepackage of claim 1, wherein the material of the at least one sacrificialthin film includes a mixture of organic small molecular material andinorganic material or a mixture of oligomers and inorganic material, andthe atomic weight or the molecular weight of the inorganic material isabout 3 g/mol˜500 g/mol.
 7. The package of claim 1, wherein the materialof the at least one sacrificial thin film includes Alq3(Tris-(8-hydroxyquinoline)aluminum), alpha-NPB(N,N′-Dis(naphthalene-1-yl)-N,N′-diphenyl-benzidine), CuPc (Phalocyaninecopper complex).
 8. The package of claim 1, wherein the material of theat least one flexible protecting thin film comprises indium tin oxide(ITO), indium zinc oxide (IZO), aluminum doped zinc oxide (AZO), WO₃,MoO₃, SiO_(x), SiN_(X), SiO_(x)N_(y), Al₂O₃, Al, Ag, Mg—Ag or Mg—Al. 9.The package of claim 2, wherein the material of the top electrode layeris equal to the material of the at least one flexible protecting thinfilm.
 10. A package of an environmental sensitive element, comprising: aflexible substrate; an environmental sensitive element disposed on theflexible substrate; a first packaging structure covering theenvironmental sensitive element; and a first flexible sacrificial layerdisposed on the first packaging structure, and the first flexiblesacrificial layer and the environmental sensitive element being locatedon two opposite sides of the first packaging structure, wherein theenvironmental sensitive element comprises a plurality of first thinfilms, the first flexible sacrificial layer includes a plurality ofsecond thin films, and the bonding strength between two adjacent secondthin films is equal to or lower than the bonding strength between twoadjacent first thin films.
 11. The package of claim 10, wherein thefirst thin films in the environmental sensitive element comprises: abottom electrode layer disposed on the flexible substrate; a displayingmedium disposed on bottom electrode layer; and a top electrode layerdisposed on the displaying medium.
 12. The package of claim 11, whereinthe second thin films in the first flexible sacrificial layer comprises:at least one first sacrificial thin film disposed on the first packagingstructure; and at least one first flexible protecting thin film disposedon the first sacrificial thin film.
 13. The package of claim 12, whereinthe first sacrificial thin film is connected to the first packagingstructure, and the first flexible protecting thin film is disconnectedto the first packaging structure.
 14. The package of claim 12, whereinboth of the first sacrificial thin film and the first flexibleprotecting thin film are connected to the first packaging structure. 15.The package of claim 12, wherein the bonding strength between the firstsacrificial thin film and the first packaging structure is equal to orlower than the bonding strength between two adjacent first thin films.16. The package of claim 12, wherein the material of the firstsacrificial thin film includes organic small molecular material with themolecular weight about 10 g/mol˜5000 g/mol.
 17. The package of claim 12,wherein the material of the first sacrificial thin film includes organicoligomers with the molecular weight about 500 g/mol˜9000 g/mol.
 18. Thepackage of claim 12, wherein the material of the first sacrificial thinfilm includes organic small molecular material or a mixture of oligomersand inorganic material, and the atomic weight or the molecular weight ofthe inorganic material is about 3 g/mol˜500 g/mol.
 19. The package ofclaim 12, wherein the material of the first sacrificial thin filmincludes Alq3 (Tris-(8-hydroxyquinoline)aluminum), alpha-NPB(N,N′-Dis(naphthalene-1-yl)-N,N′-diphenyl-benzidine), CuPc (Phalocyaninecopper complex).
 20. The package of claim 12, wherein the material ofthe first flexible protecting thin film comprises indium tin oxide(ITO), indium zinc oxide (IZO), aluminum doped zinc oxide (AZO), WO₃,MoO₃, SiO_(x), SiN_(X), SiO_(x)N_(y), Al₂O₃, Al, Ag, Mg—Ag or Mg—Al. 21.The package of claim 12, wherein the material of the top electrode layeris equal to the material of the first flexible protecting thin film. 22.The package of claim 12, further comprising a second flexiblesacrificial layer disposed on the environmental sensitive element, andthe first packaging structure covering the environmental sensitiveelement and the second flexible sacrificial layer, wherein the secondflexible sacrificial layer comprises a plurality of third thin films,and the bonding strength between two adjacent third thin films is equalto or lower than the bonding strength between two adjacent first thinfilms.
 23. The package of claim 22, wherein the third thin films in thesecond flexible sacrificial layer comprises: a second sacrificial thinfilm disposed on the top electrode; and a second flexible protectingthin film disposed on the second sacrificial thin film.
 24. The packageof claim 22, wherein the third thin films in the second flexiblesacrificial layer comprises: a plurality of second sacrificial thinfilms; and a plurality of second flexible protecting thin films, whereinthe second sacrificial thin films and the second flexible protectingthin films are alternately stacked on the environmental sensitiveelement, and the bottommost second sacrificial thin film is connected tothe top electrode layer.
 25. The package of claim 10, wherein thematerial of the flexible substrate comprises plastic material or metalthin film.
 26. The package of claim 10, wherein the first packagingstructure comprises a plurality of package thin films stacked by oneanother.
 27. The package of claim 26, wherein the package thin filmscomprises at least a layer of organic package thin film or a least alayer of inorganic package thin film.
 28. The package of claim 26,wherein the package thin films comprise: a plurality of organic packagethin films; and a plurality of inorganic package thin films, wherein theorganic package thin films and the inorganic package thin films arealternately stacked on one another.
 29. The package of claim 10, furthercomprising a second packaging structure, wherein the second packagingstructure comprises: a sealant disposed on the flexible substrate toencircle the environmental sensitive element, the first packagingstructure and the first flexible sacrificial layer; an adhesion layerdisposed within the sealant to cover the environmental sensitiveelement, the first packaging structure and the first flexiblesacrificial layer; and a flexible cover connected with the sealant andthe adhesion layer.
 30. The package of claim 10, further comprising asecond packaging structure, wherein the second packaging structurecomprises: an adhesion layer covering the environmental sensitiveelement, the first packaging structure and the first flexiblesacrificial layer; and a flexible cover connected with the sealant andthe adhesion layer.
 31. The package of claim 10, wherein the material ofthe first flexible sacrificial layer includes UV cutting material.